* Price may vary depending on order volume. For bulk orders, please request an individual quotation.
Medium viscosity UV curable adhesive developed for use as a doming and coating. Tack-free in seconds. Suitable for encapsulating electronic components, designed for low power curing systems. It provides a protective colorless film after exposure at high temperature with no shrinkage behavior; its thermal resistance for short periods (thermal shock up to +270°C) allows to sustain wave soldering.
| Technical Information | |
| Viscosity (+25 °C – mPa·s) | 1000 – 1600 |
| UV curing time (365 nm) | 3–4 seconds |
| Materials | Suitable for encapsulating electronic components, designed for low power curing systems |
| Temperature range | −55 °C / +120 °C |
