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Description
Fast curing, high strength Ultra Violet curing adhesive.
Medium viscosity UV curable adhesive developed for use as a doming and coating. Tack-free in seconds. Suitable for encapsulating electronic components, designed for low power curing systems. It provides a protective colorless film after exposure at high temperature with no shrinkage behavior; its thermal resistance for short periods (thermal shock up to +270°C) allows to sustain wave soldering.
| Technical Information | |
| Viscosity (+25 °C – mPa·s) | 1000 – 1600 |
| UV curing time (365 nm) | 3–4 seconds |
| Materials | Suitable for encapsulating electronic components, designed for low power curing systems |
| Temperature range | −55 °C / +120 °C |
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The color of the product may differ from the one shown in the picture. The product description is general, it does not necessarily mention all the features of the product. Product prices in the e-store may differ from prices in supermarkets and service centers. The balance of goods in the warehouse and in the e-store may differ, so in such cases the delivery conditions may differ from those specified at the time of placing the order and / or we may not be able to fulfill your order or only partially fulfill it (in such cases, the Buyer is informed immediately).
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Solano Industries
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