Wapa Z - Silicone Based Heat Sink Compound

A silicone oil based paste with a medium consistency, heavily fortified with heat-conductive metal oxides to insure rapid and efficient thermal conductivity.

A silicone oil based paste with a medium consistency, heavily fortified with heat-conductive metal oxides to insure rapid and efficient thermal conductivity. Heat
dissipation between power components in electrical and electronic assemblies is facilitated by the ability of this compound to fill the voids and gaps between all surface
configurations in the device. Provides extended protection for many components because of its high temperature stability, will not harden, even when exposed to extreme temperatures , compatible with plastic and metal components insuring trouble-free and effective life.
 

Properties

* good anticorrosive properties
* high temperature resistance
* insensitive against humidity
* chemically inert
* chemically inert to most materials like plastic and rubber
* does not melt
* will not harden
* non toxic
* low oil bleeding
 

Applications

* for metal and plastic semiconductors
* for transistors, diodes, and similar components